PVD Products, Inc., designs and manufactures unique thin film deposition systems and components for material scientists and process engineers. We build magnetron sputtering, Pulsed Laser Deposition, electron beam evaporation, CVD and PECVD systems. We serve both R&D and production applications.
In addition to our existing line of standard deposition products and thin film services, we provide customized systems tailored to our customers' specific needs. PVD Products provides equipment and services to customers around the world, including universities, national labs, start-ups, and Fortune 500 companies.
Pulsed Laser Deposition (PLD) systems typically use a focused pulsed excimer or Nd:YAG laser to vaporize a small section of a solid target material in a vacuum chamber in order to produce a thin film with the same chemical composition as the original target material. The PLD process enables the deposition of many complex materials over a wide range of background gas compositions and pressures. Furthermore, other types of lasers including ps and fs lasers can be utilized, and alternative techniques such as Matrix Assisted Pulsed Laser Evaporation (MAPLE) and Resonant IR Pulsed Laser Evaporation systems are available with appropriate lasers.
PVD Products offers a wide variety of PLD systems for substrates ranging in size from 5 mm square up to 300 mm in diameter. We also can provide PLD systems for roll-to-roll applications. PVD Products will be glad to assist in the selection of the proper PLD tool for your particular application. Most systems are completely computer controlled for ease of use.
PVD Products manufactures sputtering systems for depositing metal and dielectric thin films on substrates up to 300 mm in diameter. An array of magnetron sputtering sources, using RF, DC, or pulsed DC power, are operated singly or in co-deposition mode to produce a wide variety of film compositions. Our magnetron sputtering sources range in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter with options such as in-situ tilt for fine adjustments of the deposition profile. Substrate stages for wafers up to 300 mm in diameter are available with heating to 850°C and RF bias. The sputtering chamber may be fitted with additional ports for diagnostic tools such as a Residual Gas Analysis (RGA), Reflection High-Energy Electron Diffraction (RHEED), or ellipsometry.
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