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Oneida Research Services, Inc.

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Whitesboro, New York, US

About Oneida Research Services, Inc.

Founded: 1977 Type: Privately Held Size: 51-200 employees

Oneida Research Services, Inc. (ORS) offers specialized laboratory testing services to support the microelectronics, telecommunications, aerospace, automotive, medical, and defense industries. Our services focus on research, development and quality control of our client’s products: exclusively for our client.... Show more »

Oneida Research Services, Inc. (ORS) offers specialized laboratory testing services to support the microelectronics, telecommunications, aerospace, automotive, medical, and defense industries. Our services focus on research, development and quality control of our client’s products: exclusively for our client. ORS strives to develop long term relationships with our clients through unwavering professionalism, flexibility and attention to detail.

Throughout its almost 40 years of providing materials analysis services to the electronics industry, ORS has established on-going working relationships with experts in the field of applied analytical chemistry, materials/processing technology, quality systems, and component reliability. ORS and its industry experts have a wealth of experience in applying laboratory technology to solve your materials/processing, reliability, or process yield problems. We are available to consult with you, at your facility whenever appropriate, to provide technical expertise on a wide range of materials and process technology issues.

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Certifications & Qualifications

ISO 9001

Our Services (28)


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Product Environmental Testing

Price on request

Environmental stresses can contribute to device failure; by subjecting components to a variety of temperature and humidity extremes product reliability and performance expectations can be tested. Such Reliability testing of fiber optic, optoelectronic, military and aerospace components are generally specified in Telcordia... Show more »

Environmental stresses can contribute to device failure; by subjecting components to a variety of temperature and humidity extremes product reliability and performance expectations can be tested. Such Reliability testing of fiber optic, optoelectronic, military and aerospace components are generally specified in Telcordia (formerly Bellcore) General Requirements and/or Military Standard documents specifications. The suite of Mechanical and Endurance Testing requirements specified in these documents are used to provide reliability data for development and qualification of critical components.

Testing Options

  • Damp Heat Storage
  • Hermeticity Testing (Ambient or Heated)
  • High Temperature Storage
  • Low Temperature Storage

Endurance Testing

  • High Temperature Storage Test (up to 300°C)
  • Low Temperature Storage Test (down to -68°C)
  • Damp Heat Test (85°C / 85%RH or 75°C / 90%RH)
  • Moisture Cyclic Resistance Test
  • Steam Aging
  • Thermal Shock
  • Thermal Cycling

Test Methods

  • Mil-Std-883
  • Mil-Std-750
  • Mil-Std-202
  • Telcordia GR-1221-CORE
  • Telcordia GR-468-CORE
  • IEC 68-2-38
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XRF

X-Ray Fluorescence
Price on request

X-Ray Fluorescence Elemental Analysis is an analytical technique used to perform elemental identification of materials. This technique is similar to Scanning Electron Microscopy/Energy Dispersive X-Ray Analysis (SEM/EDX), which is also used to perform elemental analysis. XRF is preferred for ease of use and for non-conductive... Show more »

X-Ray Fluorescence Elemental Analysis is an analytical technique used to perform elemental identification of materials. This technique is similar to Scanning Electron Microscopy/Energy Dispersive X-Ray Analysis (SEM/EDX), which is also used to perform elemental analysis. XRF is preferred for ease of use and for non-conductive material applications such as plastics, ceramics, glasses, and liquids.

Information Obtained and Applications

  • Qualitative Bulk Analysis – Solders, metals, jewlery, plastics, ceramics, powders and liquids
  • Film or plating Analysis – Composition and thickness of PCB/PWB metallization schemes Au/Ni/Cu
  • Quantification of elemental composition including phosphorous content in Nickel
  • Identify anomalies/defects and possible causes
  • RoHS and prohibitive materials mitigation

Instrument Sensitivity/Capabilities

  • SEA 5120 Ultra Thin Window Si(Li) Detector
  • Qualitative/Quantitative analysis of microscopic objects (100µm level)
  • Detection and identification of elements Al -> U
  • A video display and frame capture capabilities of sample
  • Three collimators: 4-mil, 80-mil, and 80-mil with a Mo filter
  • Tube voltage from 15, 45 or 50kV
  • Elemental analysis and thick measurements of multiple layers
  • Sample size 80mm(W) x 80mm(D) x 35mm(H). Max weight 3kg
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Tomography Services

Computed tomography services
Price on request

X-Ray Computed Tomography (CT), commonly referred to as 3-D imaging, is a computer model generated from multiple 2-D X ray images. ORS currently has two CT systems with different design and capabilities to accommodate a broad range of samples sizes and configurations.

Description of Analysis:
Individual images or “slices” are... Show more »

X-Ray Computed Tomography (CT), commonly referred to as 3-D imaging, is a computer model generated from multiple 2-D X ray images. ORS currently has two CT systems with different design and capabilities to accommodate a broad range of samples sizes and configurations.

Description of Analysis:
Individual images or “slices” are collected in the Real-time 2-D imaging mode. The collection sequence includes a 360º rotation of the sample about an axis where the individual 2-D images are taken at predetermined intervals. The collection times can vary based on the number of intervals and frame averaging values selected.

After data collection has been completed, the 2-D images are sequentially downloaded into a modeling program for 3-D image generation.

Once a 3-D model has been created, inspection and image processing can be performed. The model can be rotated for various viewing angles, sliced to form section planes and filtered to remove obstructive content. Color may also be added for visualization enhancement.

During the 3-D inspection process, individual images may be saved for presentation purposes. The entire 3-D inspection may also be recorded in an .AVI format for viewing by the end user. X-ray images slices may also be generated in three axis providing incremental virtual cross-sectioning inspection and physical measurements.

Specifications/Capabilities:

  • Image Intensifier – 4 inch 2MB Pixel camera
  • Tube Power: 40 – 160kV up to 10Watts;
  • 1 μm Spot Size
  • Sample Handling: 6” x 4”

Specifications:

  • Scan area – size: 2” x 2”
  • Flat Panel System 8X10” 150 micron pixels
  • Tube Power: 225kV 300Watts at target 1.5 µm
  • Sample Handling > 50 pounds
  • Scan area – size 8 x 8 inch
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FT-IR

Fourier transform infrared spectroscopy
Price on request

Fourier Transform Infrared Spectroscopy (Micro FT-IR Spectroscopy) is a powerful analytical tool based on interferometery that compares the returned or transmitted light energy of the IR spectrum to the emitted source spectrum. The result is a spectrum of the infrared energy absorbed by the sample. Covalent bonding vibrational... Show more »

Fourier Transform Infrared Spectroscopy (Micro FT-IR Spectroscopy) is a powerful analytical tool based on interferometery that compares the returned or transmitted light energy of the IR spectrum to the emitted source spectrum. The result is a spectrum of the infrared energy absorbed by the sample. Covalent bonding vibrational frequencies, such as asymeteric stretching and deformation stretching is determined by correlation to the wavelengths in the IR Spectrum.

Information Obtained

Interpretation of the spectral information provides identification of functional groups or covalent bonding information. Determination of particulate or stained regions of printed circuit boards for failure analysis is possible. Identification of organic coatings on metals, paper and other materials for construction analysis purposes is also a common application. Additionally, a comparison of variations in materials for process control can be provided.

Capabilities

  • All Reflecting Objective (ARO) analysis.
  • Diamond Attenuated Transmission Reflected (ATR) analysis.
  • Infrared spectral range: 4000 to 650 wave numbers (cm-1).
  • 25 µm spot size demonstrated
  • 3000 compound library – acquired on same model instrument.

Industries

  • Electronics
  • Plastics
  • Aerospace

Applications

  • Polymers
  • Coatings
  • Metals
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Scanning Electron Microscopy (SEM)

Scanning Electron Microscopy services
Price on request

SEM images are produced by scanning a focused electron beam across the surface of a specimen. In the SE image mode, the low energy secondary electrons emitted are detected and used to modulate the brightness of a synchronously scanned CRT. Other emitted signals, such as X-rays, can also be detected and used to characterize the... Show more »

SEM images are produced by scanning a focused electron beam across the surface of a specimen. In the SE image mode, the low energy secondary electrons emitted are detected and used to modulate the brightness of a synchronously scanned CRT. Other emitted signals, such as X-rays, can also be detected and used to characterize the specimen. These X-rays energies are characteristic of the elemental composition of the specimen area probed by the primary electron beam allowing both a qualitative and quantitative determination of the elements. High energy back-scattered electrons (BSE) can be also be detected. Since the back-scattering emission efficiency is a function of atomic weight (density) which varies with elemental composition the image contrast can be exploited providing elemental spatial information.

Information Obtained

  • Surface topography if low energy secondary electrons are collected
  • Atomic number or orientation information if higher energy backscattered electrons are used for imaging
  • Differentiation between surface roughness, porosity, granular deposits, stress-related gross microcracks (often used in conjunction with microsectioning)
  • Observation of grain boundaries in unetched samples
  • Critical dimension measurements
  • Elemental Analysis

Sensitivity and Resolution

  • Lateral resolution for SEM: < 100Å
  • Lateral Resolution for EDX: 1 µm
  • Detection limits for EDX: 0.5 – 1% atomic

Instrumentation

  • Hitachi 6600 Variable Pressure FE-SEM IXRF Systems Model 550i – Silicon Drift Detector Elemental Mapping, SEI, BSE digital imaging
  • JEOL 820i Scanning Electron Microscope with Kevex light element Quantum Energy Dispersive X-Ray Analyzer, Digital Elemental Imaging, Backscattered Electron Detection
  • Cambridge Stereoscan 360 Scanning Electron Microscope with 40kV LaB6 Emitter
  • JEOL JSM-6060LV Variable Pressure Electron Microscope with Noran Six-Sigma EDS

Advantages

  • Fast, relatively inexpensive near-surface screening method
  • Depth of field is better than optical microscopy or transmission electron microscopy
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Failure Analysis

Price on request

Failure Analysis is an investigative logical process of analytical methodologies designed to determine the root cause of a failure mode. Failure analysis can provide detailed information regarding the performance of materials, components/devices and systems in their intended end use application. When a device or material does not... Show more »

Failure Analysis is an investigative logical process of analytical methodologies designed to determine the root cause of a failure mode. Failure analysis can provide detailed information regarding the performance of materials, components/devices and systems in their intended end use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer and manager, as well as the test and process engineers, to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. Having an unbiased failure analysis report performed by an independent testing laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.

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GC-MS

Gas Chromatography Coupled Mass Spectrometry
Price on request

Common applications include contamination identification, purity determination and identification of “unknown” compounds in bulk organics.

GC/MS Test Capabilities

  • PPB range sensitivity
  • Typical amu range 35-550. Instrument capability of 1.6 to 1050 amu
  • Customized instrument temperature programs
  • Scan, SIM (Select... Show more »

Common applications include contamination identification, purity determination and identification of “unknown” compounds in bulk organics.

GC/MS Test Capabilities

  • PPB range sensitivity
  • Typical amu range 35-550. Instrument capability of 1.6 to 1050 amu
  • Customized instrument temperature programs
  • Scan, SIM (Select Ion Monitoring), and synchronous SIM/Scan capability
  • Negative EI (electron impact)
  • Flexibility in sample holding temperature during analysis
  • Flexibility in sample pre-bake times
  • Flexibility in test protocol
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Residual Gas Analysis

Price on request

Used to analyze components of gas phase samples for volatile and semi-volatile organics. Uses Liquid N2 cryofocus for improved chromatography. Samples can be whole air samples collected in gas sampling cylinders provided by ORS, pharmaceutical products in hermetic packages, or other suitable containers containing gaseous samples.

Used to analyze components of gas phase samples for volatile and semi-volatile organics. Uses Liquid N2 cryofocus for improved chromatography. Samples can be whole air samples collected in gas sampling cylinders provided by ORS, pharmaceutical products in hermetic packages, or other suitable containers containing gaseous samples.

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Headspace Gas Chromatography

Price on request

A technique useful for the analysis of volatile and semi-volatile organics off-gassing from low concentration components in bulk materials, including solid and liquid matrices.

A technique useful for the analysis of volatile and semi-volatile organics off-gassing from low concentration components in bulk materials, including solid and liquid matrices.

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Energy Dispersive Spectroscopy

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Auger Electron Spectroscopy

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Hermeticity Testing

Price on request

Hermetic Seal Testing is a crucial requirement for military, space, as well as commercial hermetically sealed devices. A lack of hermeticity is a reliability concern and may allow moisture and contaminants to enter the internal cavity, which could lead to premature failure. ORS performs seal testing per Mil-Std 883 method 1014,... Show more »

Hermetic Seal Testing is a crucial requirement for military, space, as well as commercial hermetically sealed devices. A lack of hermeticity is a reliability concern and may allow moisture and contaminants to enter the internal cavity, which could lead to premature failure. ORS performs seal testing per Mil-Std 883 method 1014, Mil-Std 750 method 1071, and Mil-Std 202 Method 112 and client specific requirements. Testing is also performed per Telcordia GR1221-CORE and GR-468-CORE for passive and active devices.

Hermeticity Testing Services

  • HSHLD™ Helium Fine and Dry Gross Leak Testing
  • Krypton-85 Fine and Gross Leak Testing
  • Helium Fine Leak Hermeticity Testing
  • Gross Leak Testing Processes
  • Leak Site Identification
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Spectroscopy

Price on request
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Specialty Mass Spectrometry Methods

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Infrared Spectroscopy Services

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Product Development, Testing, and Packaging

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Chemistry and Materials

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Microscopy

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Product Testing Services

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Radiography

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Imaging & Spectroscopy

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Other Mass Spectrometry Methods

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Material Testing Services

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Analytical Chemistry Services

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Mass Spectrometry

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Chromatography

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Separation/Purification Services

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Electron Microscopy

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