Oneida Research Services, Inc. (ORS) offers specialized laboratory testing services to support the microelectronics, telecommunications, aerospace, automotive, medical, and defense industries. Our services focus on research, development and quality control of our client’s products: exclusively for our client. ORS strives to develop long term relationships with our clients through unwavering professionalism, flexibility and attention to detail.
Throughout its almost 40 years of providing materials analysis services to the electronics industry, ORS has established on-going working relationships with experts in the field of applied analytical chemistry, materials/processing technology, quality systems, and component reliability. ORS and its industry experts have a wealth of experience in applying laboratory technology to solve your materials/processing, reliability, or process yield problems. We are available to consult with you, at your facility whenever appropriate, to provide technical expertise on a wide range of materials and process technology issues.
Environmental stresses can contribute to device failure; by subjecting components to a variety of temperature and humidity extremes product reliability and performance expectations can be tested. Such Reliability testing of fiber optic, optoelectronic, military and aerospace components are generally specified in Telcordia (formerly Bellcore) General Requirements and/or Military Standard documents specifications. The suite of Mechanical and Endurance Testing requirements specified in these documents are used to provide reliability data for development and qualification of critical components.
X-Ray Fluorescence Elemental Analysis is an analytical technique used to perform elemental identification of materials. This technique is similar to Scanning Electron Microscopy/Energy Dispersive X-Ray Analysis (SEM/EDX), which is also used to perform elemental analysis. XRF is preferred for ease of use and for non-conductive material applications such as plastics, ceramics, glasses, and liquids.
Information Obtained and Applications
X-Ray Computed Tomography (CT), commonly referred to as 3-D imaging, is a computer model generated from multiple 2-D X ray images. ORS currently has two CT systems with different design and capabilities to accommodate a broad range of samples sizes and configurations.
Description of Analysis:
Individual images or “slices” are collected in the Real-time 2-D imaging mode. The collection sequence includes a 360º rotation of the sample about an axis where the individual 2-D images are taken at predetermined intervals. The collection times can vary based on the number of intervals and frame averaging values selected.
After data collection has been completed, the 2-D images are sequentially downloaded into a modeling program for 3-D image generation.
Once a 3-D model has been created, inspection and image processing can be performed. The model can be rotated for various viewing angles, sliced to form section planes and filtered to remove obstructive content. Color may also be added for visualization enhancement.
During the 3-D inspection process, individual images may be saved for presentation purposes. The entire 3-D inspection may also be recorded in an .AVI format for viewing by the end user. X-ray images slices may also be generated in three axis providing incremental virtual cross-sectioning inspection and physical measurements.
Fourier Transform Infrared Spectroscopy (Micro FT-IR Spectroscopy) is a powerful analytical tool based on interferometery that compares the returned or transmitted light energy of the IR spectrum to the emitted source spectrum. The result is a spectrum of the infrared energy absorbed by the sample. Covalent bonding vibrational frequencies, such as asymeteric stretching and deformation stretching is determined by correlation to the wavelengths in the IR Spectrum.
Interpretation of the spectral information provides identification of functional groups or covalent bonding information. Determination of particulate or stained regions of printed circuit boards for failure analysis is possible. Identification of organic coatings on metals, paper and other materials for construction analysis purposes is also a common application. Additionally, a comparison of variations in materials for process control can be provided.
SEM images are produced by scanning a focused electron beam across the surface of a specimen. In the SE image mode, the low energy secondary electrons emitted are detected and used to modulate the brightness of a synchronously scanned CRT. Other emitted signals, such as X-rays, can also be detected and used to characterize the specimen. These X-rays energies are characteristic of the elemental composition of the specimen area probed by the primary electron beam allowing both a qualitative and quantitative determination of the elements. High energy back-scattered electrons (BSE) can be also be detected. Since the back-scattering emission efficiency is a function of atomic weight (density) which varies with elemental composition the image contrast can be exploited providing elemental spatial information.
Sensitivity and Resolution
Failure Analysis is an investigative logical process of analytical methodologies designed to determine the root cause of a failure mode. Failure analysis can provide detailed information regarding the performance of materials, components/devices and systems in their intended end use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer and manager, as well as the test and process engineers, to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. Having an unbiased failure analysis report performed by an independent testing laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.
Common applications include contamination identification, purity determination and identification of “unknown” compounds in bulk organics.
GC/MS Test Capabilities
Used to analyze components of gas phase samples for volatile and semi-volatile organics. Uses Liquid N2 cryofocus for improved chromatography. Samples can be whole air samples collected in gas sampling cylinders provided by ORS, pharmaceutical products in hermetic packages, or other suitable containers containing gaseous samples.
A technique useful for the analysis of volatile and semi-volatile organics off-gassing from low concentration components in bulk materials, including solid and liquid matrices.
Hermetic Seal Testing is a crucial requirement for military, space, as well as commercial hermetically sealed devices. A lack of hermeticity is a reliability concern and may allow moisture and contaminants to enter the internal cavity, which could lead to premature failure. ORS performs seal testing per Mil-Std 883 method 1014, Mil-Std 750 method 1071, and Mil-Std 202 Method 112 and client specific requirements. Testing is also performed per Telcordia GR1221-CORE and GR-468-CORE for passive and active devices.
Hermeticity Testing Services
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