At Nanoscience Technologies we connect the dots between device design, fabrication, characterization and failure analysis all under one roof with competitive cost. We will develop, implement and integrate ideas tailored according to the complexity and time constraints of our clients. Our approach is to offer flexible service that can provide either access to single or multiple process steps with the ambition of reinventing how nanotechnology can order experiments, analyze, and inspire their peers to act.
We offer wide range R&D proof of concept to feasibility studies to low volume prototyping projects in semiconductor, MEMS, Optoelectronics and Microfluidics.
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Mask Design and Mask Making
Thin Film Deposition
Furnace Anneal, Oxidation and RTP
LPCVD, PECVD and ALD process
Dry Plasma Etch
Wet Etch Processing
Wafer Bonding, Sawing and Polishing
We are an innovation-driven company with expertise in creating solutions for biotechnology by merging the latest advances in nanotechnology and microfluidics. We offer micro & nano fabrication and lab on chip services using UV photolithography, casting in PDMS and PMMA.
Lab on Chip PDMS and PMMA Stamps
Silicon based Nano Microfluidic Device
We combine our knowledge and resources to help you find the best material characterization solutions, while helping you to save time and cost.
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Nano Material Characterization
Nano Chemical Material Analysis
Nano Solid-State Physics
Understanding the device fundamentals that drives the development of new devices, we bring specialized talent in semiconductor physics, Optics and Device analysis.
Electrical Characterization & Device Measurements
Our staff are ready to help you determine the root cause, so that the solutions can be developed quickly, preventing further failures and reducing downtime racing your goals.
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Failure Analysis and Root cause studies
Instrument : Carl Zeiss Ultra FE-SEM
Resolution : 1nm at 15 KV
Instrument: Park Systems XE100 AFM
Resolution: XY stage travel range 150 mm (200 mm optional)
Z stage travel range is 25 mm Scan range is up to 30 um
Precision surface morphology analysis with contact, non contact and tapping mode.
|Lateral Force Microscopy LFM||Magnetic Force Microscopy MFM|
|Kelvin Probe Microscopy KPM||Scanning Spreading Resistance SSRM|
|Scanning Tunneling Microscopy STM||Conductive Force Microscopy CAFM|
Instrument: FEI Titan Themis 3 series
Resolution: Ultra-bright XFEG Gun, 60–300 kV beam-sensitive samples
Instrument: Zeta PALS BH
Resolution: Particle size 1nm to 100um, Zeta potential -220 mV to +220 mV
Instrument: Rigaku SmartLAB
Resolution: 4-Circle Diffractometer HR XRD, Pilatus 2-D detector
Instrument: LabRAM HR
Resolution: Visible Raman with 325nm and 514nm laser source
Instrument : Axis Ultra XPS
Resolution : Spot size 15 microns, depth resolution 10A to 100A
Instrument: FTIR Perkin Elmer
Resolution: KBr beam splitter with spectral range 7800 to 380 cm^-1
Instrument: Helios NanoLAB FEI
Resolution: 1 nm @ 15 kV, 1.6 nm @ 5 kV, Electron beam resolution. 2.5 nm at 30 kV Ion beam resolution.
Instrument: Shimadzu MPC3 series
Resolution: UV-VIS-NIR with 200 nm to 3200 nm UV to NIR spectra range
Curve Tracer and Device Parameter Probe Bench
Semiconductor Parameter Analyzer Probe Station
RF Probe Station Test Bench
Solid state physics services
Solar PV Lifetime & Efficiency services
Instrument: Scanning Acoustic Microscope SAM KSI v4.0
Resolution: Transducer at 100 MHz, 230 MHz and 400 MHz
Instrument: Micro System Analyzer 5 Series
Resolution: Frequency range 0 to 20 MHz, 2nm in-plane resolution
In-Line Metrology Services
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