At Nanoscience Technologies we connect the dots between device design, fabrication, characterization and failure analysis all under one roof with competitive cost. We will develop, implement and integrate ideas tailored according to the complexity and time constraints of our clients. Our approach is to offer flexible service that can provide either access to single or multiple process steps with the ambition of reinventing how nanotechnology can order experiments, analyze, and inspire their peers to act.
We offer wide range R&D proof of concept to feasibility studies to low volume prototyping projects in semiconductor, MEMS, Optoelectronics and Microfluidics.
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Mask Design and Mask Making
| Lithography
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Thin Film Deposition
| Furnace Anneal, Oxidation and RTP
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LPCVD, PECVD and ALD process
| Dry Plasma Etch
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Wet Etch Processing
| Wafer Bonding, Sawing and Polishing
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We are an innovation-driven company with expertise in creating solutions for biotechnology by merging the latest advances in nanotechnology and microfluidics. We offer micro & nano fabrication and lab on chip services using UV photolithography, casting in PDMS and PMMA.
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Lab on Chip PDMS and PMMA Stamps
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Silicon based Nano Microfluidic Device
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We combine our knowledge and resources to help you find the best material characterization solutions, while helping you to save time and cost.
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Nano Material Characterization
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Nano Chemical Material Analysis
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Nano Solid-State Physics
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Understanding the device fundamentals that drives the development of new devices, we bring specialized talent in semiconductor physics, Optics and Device analysis.
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Electrical Characterization & Device Measurements
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Our staff are ready to help you determine the root cause, so that the solutions can be developed quickly, preventing further failures and reducing downtime racing your goals.
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Failure Analysis and Root cause studies
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Instrument : Carl Zeiss Ultra FE-SEM
Resolution : 1nm at 15 KV
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Instrument: Park Systems XE100 AFM
Resolution: XY stage travel range 150 mm (200 mm optional)
Z stage travel range is 25 mm Scan range is up to 30 um
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Precision surface morphology analysis with contact, non contact and tapping mode.
Lateral Force Microscopy LFM | Magnetic Force Microscopy MFM |
Kelvin Probe Microscopy KPM | Scanning Spreading Resistance SSRM |
Scanning Tunneling Microscopy STM | Conductive Force Microscopy CAFM |
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Instrument: FEI Titan Themis 3 series
Resolution: Ultra-bright XFEG Gun, 60–300 kV beam-sensitive samples
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Instrument: Zeta PALS BH
Resolution: Particle size 1nm to 100um, Zeta potential -220 mV to +220 mV
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Instrument: Rigaku SmartLAB
Resolution: 4-Circle Diffractometer HR XRD, Pilatus 2-D detector
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Instrument: LabRAM HR
Resolution: Visible Raman with 325nm and 514nm laser source
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Instrument : Axis Ultra XPS
Resolution : Spot size 15 microns, depth resolution 10A to 100A
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Instrument: FTIR Perkin Elmer
Resolution: KBr beam splitter with spectral range 7800 to 380 cm^-1
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Instrument: Helios NanoLAB FEI
Resolution: 1 nm @ 15 kV, 1.6 nm @ 5 kV, Electron beam resolution. 2.5 nm at 30 kV Ion beam resolution.
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Instrument: Shimadzu MPC3 series
Resolution: UV-VIS-NIR with 200 nm to 3200 nm UV to NIR spectra range
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Curve Tracer and Device Parameter Probe Bench
Semiconductor Parameter Analyzer Probe Station
RF Probe Station Test Bench
Solid state physics services
Solar PV Lifetime & Efficiency services
Instrument: Scanning Acoustic Microscope SAM KSI v4.0
Resolution: Transducer at 100 MHz, 230 MHz and 400 MHz
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Instrument: Micro System Analyzer 5 Series
Resolution: Frequency range 0 to 20 MHz, 2nm in-plane resolution
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In-Line Metrology Services
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