Nanoscience Technologies LLC

We offer wide range R&D proof of concept to feasibility studies to low volume prototyping projects in semiconductor, MEMS, Optoelectronics and Microfluidics.

Visit  Our fabrication Services

We are an innovation-driven company with expertise in creating solutions for biotechnology by merging the latest advances in nanotechnology and microfluidics. We offer micro & nano fabrication and lab on chip services using UV photolithography, casting in PDMS and PMMA.

Visit Our Microfluidics Fabrication Services

We combine our knowledge and resources to help you find the best material characterization solutions, while helping you to save time and cost.
Visit Our Material Science Services

Understanding the device fundamentals that drives the development of new devices, we bring specialized talent in semiconductor physics, Optics and Device analysis.

Visit Our Electrical Characterization Services

Our staff are ready to help you determine the root cause, so that the solutions can be developed quickly, preventing further failures and reducing downtime racing your goals. 

Visit Our FA Services

Instrument : Carl Zeiss Ultra FE-SEM

Resolution : 1nm at 15 KV

Specs :

• Ultra high resolution imaging at low kV
• Fully integrated EDS detector for compositional information
• CL Detector for Cathodoluminescence

Applications :

1. Failure analysis and Reverse engineering
2. Grain size, Sample cross sections, Surface morphology, Defect studies
   

Instrument:  Park Systems XE100 AFM
Resolution: XY stage travel range 150 mm (200 mm optional)
Z stage travel range is 25 mm Scan range is up to 30 um  
Specs:
Precision surface morphology analysis with contact, non contact and tapping mode.

Applications:

1. Surface RMS roughness, Step Height and Surface morphology
2. Surface potential, Work function extraction
3. Young's modulus, Electric and magnetic surface domain mapping
   

Instrument:  FEI Titan Themis 3 series
Resolution:  Ultra-bright XFEG Gun, 60–300 kV beam-sensitive samples
Specs:

• Lorenz mode for magnetic properties
• Super X-quad EDS detector
• HRTEM and STEM mode
• HAADF and triple dark field-bright field detectors
• Selected Area Electron Diffraction SAED studies
  

Applications:

1. Surface SAED, HRTEM Elemental analysis
2. Cross section failure analysis and dislocation defect studies
3. Analytical material science studies of grain boundary voids and stacking faults
4. Crystalline defect studies and elemental mapping
   

Instrument: Zeta PALS BH
Resolution: Particle size 1nm to 100um, Zeta potential -220 mV to +220 mV
Specs:

• Sample mobility rage 10^-11to 10^-7 m2/v
• Sample concentration 10 % v/V
• Sample Volume 180 ul, 600 ul, 1250 ul
• Sample conductivity 300 s/m
  

Applications:

1. Determination of stability in colloidal dispersion
2. Quantitative analysis of electrophoretic mobility and Dynamic mobility
3. Chemical fingerprinting in polymer and glass
   

Instrument: Rigaku SmartLAB
Resolution: 4-Circle Diffractometer HR XRD, Pilatus 2-D detector  
Tool Specs:

• Rocking curve, Reciprocal space substrate mapping In-Plane HR XRD
• X-ray topography mapping
• Pole figure orientation measurements
  

Applications:

1. Rocking curve analysis
2. Phase composition and residual strain measurements
3. Texture orientation measurements
4. Phase composition, Lattice parameters and alloy composition investigations
   

Instrument: LabRAM HR
Resolution: Visible Raman with 325nm and 514nm laser source
Tool Specs:

• Visible range with CCD multi window
• Near IR (NIR) with GaAs detector ( 800nm to 1600nm)
• Lower temperature limits and analysis up to 7K

Applications:

1. Photo luminescence spectroscopy
2. Raman resonance, Raman surface enhancement IR-PL mapping
3. Chemical fingerprinting on polymer, ceramic and glass substrates
4. Vibration frequency measurements
   

Instrument : Axis Ultra XPS
Resolution : Spot size 15 microns, depth resolution 10A to 100A
Specs :

• High energy resolution and charge neutralization features
• Ultra fast parallel imaging
• Quantitative chemical mapping

Applications :

1. Surface analysis and Chemical mapping of all elements except for H and He
2. Depth profiling and Elemental composition
   

Instrument:  FTIR Perkin Elmer
Resolution: KBr beam splitter with spectral range 7800 to 380 cm^-1
Tool Specs:

• Infrared absorption spectral resolution 0.5 to 64 cm^-1
• Repeatability wavelength of +/-0.02 cm at 1,600 cm
• TGS, Liquid N2 cooled MCT detectors
• Supporting Extensions: UATR, Diffusive reflectance, Transmittance and TG-IR

Applications:

1. Identification of complex mixtures of materials, gasses, thick films, liquids, and solid polymers
2. Surface analysis of adhesives, coatings and polymer adhesion
3. Material identification and fingerprinting.
   

Instrument: Helios NanoLAB FEI
Resolution: 1 nm @ 15 kV, 1.6 nm @ 5 kV, Electron beam resolution. 2.5 nm at 30 kV Ion beam resolution.
Tool Specs:

• TEM sample lamella preparation
• Sample size up to 150 mm diameter with full rotation max clearance of 55 mm
• Platinum, Tungsten and Carbon deposition

Applications:

1. Circuit Edits
2. APEX cuts, Micro manipulator cross section
3. Device reverse engineering
4. Structure cuts and Tomography 
   

Instrument:  Shimadzu MPC3 series  
Resolution: UV-VIS-NIR with 200 nm to 3200 nm UV to NIR spectra range  
Tool Specs:

• PMT, InGaAs, PdS detector support integration
• Absolute specular reflectance, diffuse reflectance modes
• Temperature range 5 C to 45 C
• Greater than 0.2 mL liquid samples

Applications:

1. Absorption, transmission studies on solid and thin film substrates
2. Optical investigation properties of liquids and solids b/n 200 nm to 3300 nm spectra range
   

Curve Tracer and Device Parameter Probe Bench

• CV Impedance Test and Analysis
• CV Impedance Dissipation factor on passive components
• Mobile ion studies, SiOx and SiNx layer integrity
• Determine breakdown voltages and IV's
• Measurement of resistance, Capacitance, Carrier Recombination, Metal Insulator Metal profiles
  

Semiconductor Parameter Analyzer Probe Station

• Variable temperature
• 0.1fA | 0.5 uV measurement resolution
• CV sweeps 1KHz – 5 MHz
• Probe tips 10 um
• Probe stations includes microscope/video system, vibration isolation table, probe card holders
• RF and SMU DC probes needles calibration software and standards
• Measurements of IV, Id-Vd, Id-Vg, Break down, Carrier Recombination
• Reliability life time, Pulsed Id-Vd.
• Determining Mobility and Threshold Voltage in CMOS, RF MMIC and Memory devices
• Test and pad structure design to extract Threshold Voltages, Body effect, Transconductance, Channel doping simulation.

RF Probe Station Test Bench

• Frequency Range : 9 kHz to 70 GHz
• Impedance : 50 ohm or 75 ohm
• Loss Parameter : 94 dB with 0.006 dB trace noise
• RF probe station for the research of advanced active and passive components
• Stage comes with zoom microscope with 20X and 50 X magnification, LED ring Illuminator, precision x-y stage with RF probe tips
• Determine Time -Domain -Gating mode, Pulsed RF, Return Loss, Impedance, Insertion Loss
• Measurement and failure analysis Transmission Coefficient
• Frequency conversion, S-Parameter, Antenna, Smith chart and signal integrity measurements
  

Solid state physics services 

• Hall Mobility, MPMS, SQUID measurements
• Hall Voltage,Carrier Concentration, Coefficient and Carrier mobility
• Low Temperature Liquid N2 and He Superconducting pulse measurement and analysis
• Probe Size :10 um to 3 um. 5 Probes DC Supply
• Liquid N2 : 77 Kelvin to 400 Kelvin
• Liquid He : 5 Kelvin to 500 Kelvin

Solar PV Lifetime & Efficiency services

• Determine Isc, Jsc, Short Circuit Current Isc, Sun Voc
• Open Circuit Voltage Voc slope, Shunt resistance Rs measurements 
• Measurement and result analysis of Maximum Power Pmax ( Vmax and Imax)
• Investigation of FF, Fill Factor conversion efficiency, IQE, EQE, n-efficiency conversion
• Sample Size : 100m to 156 mm Si and pseudo squares.
  

Instrument:  Scanning Acoustic Microscope SAM KSI v4.0  
Resolution: Transducer at 100 MHz, 230 MHz and 400 MHz
Specs:

• Scanning modes in A, B, C, D, 3D, Sequence, Auto Profile and X-scan
• HQ, FFT, B-Scan measurements
• Max scan area 400 x 400 mm

Applications:

1. Failure Analysis on PCB for interfacial de-lamination, inter connect joints, die bonding, aseal analysis and void detection
2. PCB anomalies, Encapsulated IC packages
3. PCB reverse engineering, wafer bonding, PCB lamination and Ceramic packaging
4. Interconnect via metal investigation
   

Instrument:  Micro System Analyzer 5 Series
Resolution:  Frequency range 0 to 20 MHz, 2nm in-plane resolution  
Specs:

• Ultra-density sample grids with 512 X user specified measurement points
• In-Plane motion detection up to 1MHz
• Rapid 3D topography non-contact measurement with nano meter resolution 

Applications:

1. Static and Dynamic characterization of MEMS devices
2. Frequency domain resonance analysis
3. Time domain and damping studies on 3D MEMS structures 
   

In-Line Metrology Services

• Atomic Force Microscope AFM
• Spectroscopic Ellipsometer
• Resistivity mapping
• Profilometer, Stress tester, Particle counters and Optical microscope